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About Me

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Personal Information
  • D.O.B : Feb-24-1993

  • HOMETOWN : Ho Chi Minh City – Sai Gon, Vietnam

  • HOBBIES : Reading, Cooking, Music, Badminton, Swimming, Biking, and Investing & Trading

Research
Interests

Signal Processing with applications in Wireless Communications & Networking, Learning, Security, and Healthcare Systems.

Education
University of Maryland, College Park, USA (Ongoing)
Ph.D., Electrical Engineering

​2018 - present

 

  • G.P.A : TBD

  • Concentration : Communications & Signal Processing

  • Selected Coursework :

    • ENEE 620 - Random Processes

    • ENEE 630 - Advanced Digital Signal Processing

    • ENEE 633 - Statistical Pattern Recognition

 

 

Ohio State University, Columbus, USA
B.S., Electrical & Computer Engineering
2015 - 2018

 

  • G.P.A : 3.694/4.000 (Cum Laude Graduation)

  • Concentration : Computer Engineering

  • Selected Coursework :

    • CSE 2221 - Software Components

    • CSE 2231 - Software Development & Design

    • CSE 2321 - Discrete Mathematics

    • CSE 2331 - Data Structures & Algorithms

    • ECE 5000 - Analog & Digital Communications

    • ECE 5013 - Introduction to Radars

    • ECE 5101 - Introduction to Wireless Networking

    • ECE 5200 - Digital Signal Processing

    • ECE 5206 - Medical Imaging Processing

 

 

Ho Chi Minh City University of Technology (a.k.a. Bach Khoa University) - Vietnam National University System, Vietnam
B.S., Electrical & Electronics Engineering

​2011 - 2014

 

  • G.P.A : 8.32/10.00 (Top 10% Departmental)

  • Concentration : Non-Determined

  • Transferred to Ohio State University after 5 semesters

Technical Skills
  • Competent : 

    • Analog​ & Digital Communications

    • Digital Circuit Design

    • ModelSim

    • Signal Processing

    • Simulink

  • Familiar With :

    • Cadence OrCAD

    • Cadence Virtuoso

    • PCB Design

    • Linux O.S.

    • Quartus II

    • SolidWorks

    • TensorFlow

Languages
  • Competent : 

    • C/C++​

    • Java

    • MATLAB

    • VHDL

  • Familiar With :

    • Assembly

    • BASIC

    • Python

    • Verilog HDL

Education
Publications
Journal Papers

​2018 - present

 

TBD

Conference Proceedings

​2018 - present

 

TBD

 

 

Patents and Disclosures

​2018 - present

 

TBD

Honors & Awards
  • 2018: Inducted into IEEE-Eta Kappa Nu Honor Society, Gamma Chapter at the Ohio State University

  • 2015-2018: Ohio State University’s College of Engineering Dean’s List

  • 2015-2016: Gee Scholarship for Academic Excellence

  • 2011-2014: Ho Chi Minh City University of Technology’s Merit-based Scholarship for academic excellence & Dean's List for being top 20% students in the Department

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